The new technology of electroless cobalt has lower resistance and enhanced electromigration resistance compared to alternative barriers that are used today. Therefore, for submicron technology, the new technology yields better global interconnect delay, improved reliability and increased resistance to corrosion.
Furthermore, it is well conformed to the use since the deposition is a surface reaction which is limited due to the high diffusion of the species material in the liquid phase.
Project ID : 11-2007-122
The Technology
The new technology of electroless cobalt has lower resistance and enhanced electromigration resistance compared to alternative barriers that are used today. Therefore, for submicron technology, the new technology yields better global interconnect delay, improved reliability and increased resistance to corrosion.
Furthermore, it is well conformed to the use since the deposition is a surface reaction which is limited due to the high diffusion of the species material in the liquid phase.
Potential Application and the Need
In integrated circuit (IC) manufacturing, copper based interconnects technology faces several problems such as metal corrosion, weak adhesion, high chemical reactivity, copper surface electromigration, corrosion (mainly post CMP) and considerable transport of copper in common ILD materials. The application of thin barrier and capping layers for copper interconnects technology solves those problems: Typically, a barrier layer is connected in parallel to the interconnect line and occupies volume that would otherwise be used for signal conduction by the copper. Therefore, the barrier should be as thin as possible without affecting its integrity. Our technology is able to satisfy these conditions at a thickness of nanometers.
Patents
Two granted US patents
Project manager
Rona Samler
VP, BD Physical Science, Medical Device, Chemistry
Project researchers
Yosi Shacham- Diamand
T.A.U Tel Aviv University, Engineering
School of Electrical Engineering
Ramot is Tel Aviv University's (TAU) technology transfer company and its liaison to industry, bringing promising scientific discoveries made at the university to industry's attention. The company provides the legal and commercial frameworks for inventions made by TAU faculty, students and researchers, protecting discoveries with patents and working jointly with industry to bring scientific innovations to the market.
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